PI Film F38

F38  
Polyimide film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and medium resistance. It can be used in the temperature range of -269°C to 280°C for a long time, and can reach 400°C in a short time. high temperature. F38 polyimide film is produced using a special formula. It has excellent comprehensive performance, lower shrinkage, and higher dimensional stability, especially in high-temperature labels, substrates, and FPC (flexible printed circuits). It is widely used in the applications of board) materials, LED circuit boards, LED light bars, and copper-clad films.